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1 ? fn6363.1 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e 16.5kv esd (iec61000- 4-2) protected, large output swing, 5v , full fail-safe, 1/8 unit load, rs-485/rs-422 transceivers the isl315xe are bicmos, ie c61000 esd protected, 5v powered, single transceivers t hat meet both the rs-485 and rs-422 standards for balanced communication. each driver output and receiver input is protected against 16.5kv esd strikes without latch-up. the isl315xe transmitters all deliver exceptional differential output voltages (2.4v min), into the rs-485 required 54 load, for better noise immunity or to allow up to eight 120 terminations in ?star? or other non-standard bus topologies. these devices have very low bus currents (+125 a/-75 a), so they present a true ?1/8 uni t load? to the rs-485 bus. this allows up to 256 transceivers on the network without violating the rs-485 specification?s 32 uni t load maximum, and without using repeaters. receiver (rx) inputs feature a ?full fail-safe? design, which ensures a logic high rx output if rx inputs are floating, shorted, or on a terminated bu t undriven bus. rx outputs feature high drive levels - typically 28ma @ v ol = 1v (to ease the design of optocoupled isolated interfaces). the isl3150e, isl3152e, isl3153e, isl3155e utilize slew rate limited drivers which reduce emi, and minimize reflections from improperly terminated trans mission lines, or unterminated stubs in multidrop and multipoint applications. hot plug circuitry ensures that the tx and rx outputs remain in a high impedance state until the power supply has stabilized, and the tx outputs are fully short circuit protected. the isl3150e, isl3153e, isl3156e are configured for full duplex applications. the half duplex versions multiplex the rx inputs and tx outputs to allow transceivers with output disable functions in 8 ld packages. features ? high driver v od . . . . . . . . . . . . . . 2.4v (min) @ r d = 54 better noise immunity, or drive up to 8 terminations ? iec61000 esd protection on rs-485 i/o pins . . 16.5kv - class 3 esd level on all other pins . . . . . . >7kv hbm ? tiny msop packages save 50% board space ? full fail-safe (open, short, terminated and undriven) receivers ? high rx i ol to drive opto-couplers for isolated applications ? hot plug circuitry - tx and rx outputs remain three-state during power-up/power-down ? true 1/8 unit load allows up to 256 devices on the bus ? specified for single 5v, 10% tolerance, supplies ? high data rates . . . . . . . . . . . . . . . . . . . . . up to 20mbps ? low quiescent supply current . . . . . . . . . . . . . . . 600 a ultra low shutdown supply current . . . . . . . . . . . . 70na ? -7v to +12v common mode input voltage range ? half and full duplex pinouts ? pb-free (rohs compliant) ? three-state rx and tx outputs ? current limiting and thermal shutdown for driver overload protection applications ? utility meters and automated meter reading systems ? high node count systems ? profibus? and field bus networks, and factory automation ? security camera networks ? building lighting and environmental control systems ? industrial/process control networks table 1. summary of features part number half/full duplex data rate (mbps) slew-rate limited? hot plug # devices on bus rx/tx enable? quiescent i cc ( a) low power shutdown? pin count isl3150e full 0.115 yes yes 256 yes 600 yes 10, 14 isl3152e half 0.115 yes yes 256 yes 600 yes 8 isl3153e full 1 yes yes 256 yes 600 yes 10, 14 isl3155e half 1 yes yes 256 yes 600 yes 8 isl3156e full 20 no yes 256 yes 600 yes 10, 14 isl3158e half 20 no yes 256 yes 600 yes 8 data sheet caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2004-2006, 2008. all rights reserved all other trademarks mentioned are the property of their respective owners. january 18, 2008
2 fn6363.1 january 18, 2008 pinouts isl3152e, isl3155e, isl3158e (8 ld msop, 8 ld soic, 8 ld pdip) top view isl3150e, isl3153e, isl3156e (10 ld msop) top view isl3150e, isl3153e, isl3156e (14 ld soic) top view ro re de di 1 2 3 4 8 7 6 5 v cc b/z a/y gnd d r ro re de di gnd v cc a b z y 1 2 3 4 5 10 9 8 7 6 d r nc ro re de di gnd gnd v cc nc a b z y nc 1 2 3 4 5 6 7 14 13 12 11 10 9 8 d r ordering information part number (note) part marking temp. range (c) package (pb-free) pkg. dwg. # isl3150eibz* 3150eibz -40 to +85 14 ld soic m14.15 isl3150eiuz* 3150z -40 to +85 10 ld msop m10.118 isl3152eibz* 3152eibz -40 to +85 8 ld soic m8.15 isl3152eipz isl3152 eipz -40 to +85 8 ld pdip** e8.3 isl3152eiuz* 3152z -40 to +85 8 ld msop m8.118 isl3153eibz* 3153eibz -40 to +85 14 ld soic m14.15 isl3153eiuz* 3153z -40 to +85 10 ld msop m10.118 isl3155eibz* 3155eibz -40 to +85 8 ld soic m8.15 isl3155eiuz* 3155z -40 to +85 8 ld msop m8.118 ISL3156EIBZ* 3156eibz -40 to +85 14 ld soic m14.15 isl3156eiuz* 3156z -40 to +85 10 ld msop m10.118 isl3158eibz* 3158eibz -40 to +85 8 ld soic m8.15 isl3158eiuz* 3158z -40 to +85 8 ld msop m8.118 *add ?-t? suffix for tape and reel. please refe r to tb347 for details on reel specifications. **pb-free pdips can be used for through hole wave solder proces sing only. they are not intended for use in reflow solder proces sing applications. note: these intersil pb-free plastic packaged products employ special pb-free material sets; molding compounds/die attach materi als and 100% matte tin plate plus anneal - e3 terminatio n finish, which is rohs compliant and compat ible with both snpb and pb-free solderin g operations. intersil pb-free products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements o f ipc/jedec j std-020. isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
3 fn6363.1 january 18, 2008 truth tables transmitting inputs outputs re de di z y x1101 x1010 0 0 x high-z high-z 1 0 x high-z* high-z* note: *shutdown mode (see note 7). receiving inputs output re de half duplex de full duplex a-b ro 00 x -0.05v 1 00 x -0.2v 0 0 0 x inputs open/shorted 1 10 0 xhigh-z* 1 1 1 x high-z note: *shutdown mode (see note 7). pin descriptions pin function ro receiver output: if a-b -50mv, ro is high; if a-b -200mv, ro is low; ro = high if a a nd b are unconnected (floating) or shorted. re receiver output enable. ro is enabled when re is low; ro is high impedance when re is high. de driver output enable. the driver outputs, y and z, are enabled by bringing de high. they ar e high impedance when de is low. di driver input. a low on di forces output y low and output z hi gh. similarly, a high on di forces output y high and output z lo w. gnd ground connection. a/y 16.5kv iec61000 esd protected rs-485/rs-422 level, non-invert ing receiver input and noninverting driver output. pin is an i nput if de = 0; pin is an output if de = 1. b/z 16.5kv iec61000 esd protected rs-485/rs-422 level, inverting receiver input and inverting driver output. pin is an input if de = 0; pin is an output if de = 1. a 16.5kv iec61000 esd protected rs-485/rs-422 level, non-inverting receiver input. b 16.5kv iec61000 esd protected rs-485/rs-422 level, inverting receiver input. y 16.5kv iec61000 esd protected rs-485/rs-422 level, non-inverting driver output. z 16.5kv iec61000 esd protected rs-485/rs-422 level, inverting driver output. v cc system power supply input (4.5v to 5.5v). nc no connection. isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
4 fn6363.1 january 18, 2008 typical operating circuit isl3152e, isl3155e, isl3158e isl3150e, isl3153e, isl3156e (soic pin numbers shown) 0.1f + d r 7 6 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +5v 0.1f + d r 6 7 8 1 2 3 4 5 v cc gnd ro re de di a/y b/z +5v r t r t 0.1f + d r 12 11 10 9 14 2 3 4 5 6, 7 v cc gnd ro re de di a b y z +5v 0.1f + d r 12 11 10 9 14 2 3 4 5 6, 7 v cc gnd ro re de di a b y z +5v r t r t isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
5 fn6363.1 january 18, 2008 absolute maximum rati ngs thermal information v cc to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7v input voltages di, de, re . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to (v cc + 0.3v) input/output voltages a/y, b/z, a, b, y, z . . . . . . . . . . . . . . . . . . . . . . . . . . . -9v to +13v a/y, b/z, a, b, y, z (transient pulse through 100 ) . . . . . . 25v ro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to (v cc +0.3v) short circuit duration y, z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table thermal resistance (typical, note 1) ja (c/w) 8 ld soic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 8 ld msop, pdip* . . . . . . . . . . . . . . . . . . . . . . . . . . 140 10 ld msop. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 14 ld soic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 maximum junction temperature (plastic package) . . . . . . +150c maximum storage temperature range . . . . . . . . . .-65c to +150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp *pb-free pdips can be used for through hole wave solder processing only. they are not intended for use in reflow solder processing applications. operating conditions temperature range . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to +85c caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. note: 1. ja is measured with the component mounted on a high effective therma l conductivity test board in free air. see tech brief tb379 f or details. electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwise specified. typicals are at v cc = 5v, t a = +25c (note 2). parameter symbol test conditions temp (c) min (note 10) typ max (note 10) units dc characteristics driver differential v out (no load) v od1 full - - v cc v driver differential v out (loaded) v od2 r l = 100 (rs-422) (figure 1a) full 2.8 3.6 - v r l = 54 (rs-485) (figure 1a) full 2.4 3.1 v cc v r l = 15 (eight 120 terminations) (note 11) 25 - 1.65 - v r l = 60 , -7v v cm 12v (figure 1b) full 2.4 3 - v change in magnitude of driver differential v out for complementary output states v od r l = 54 or 100 (figure 1a) full - 0.01 0.2 v driver common-mode v out v oc r l = 54 or 100 (figure 1a) full - - 3.15 v change in magnitude of driver common-mode v out for complementary output states v oc r l = 54 or 100 (figure 1a) full - 0.01 0.2 v logic input high voltage v ih de, di, re full 2 - - v logic input low voltage v il de, di, re full - - 0.8 v di input hysteresis voltage v hys 25 - 100 - mv logic input current i in1 de, di, re full -2 - 2 a input current (a, b, a/y, b/z) i in2 de = 0v, v cc = 0v or 5.5v v in = 12v full - 70 125 a v in = -7v full -75 55 - a output leakage current (y, z) (full duplex versions only) i in3 re = 0v, de = 0v, v cc = 0v or 5.5v v in = 12v full - 1 40 a v in = -7v full -40 -9 - a output leakage current (y, z) in shutdown mode (full duplex) i in4 re = v cc , de = 0v, v cc = 0v or 5.5v v in = 12v full - 1 20 a v in = -7v full -20 -9 - a isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
6 fn6363.1 january 18, 2008 driver short-circuit current, v o = high or low i osd1 de = v cc , -7v v y or v z 12v (note 4) full - - 250 ma receiver differential threshold voltage v th -7v v cm 12v full -200 -90 -50 mv receiver input hysteresis v th v cm = 0v 25 - 20 - mv receiver output high voltage v oh i o = -8ma, v id = -50mv full v cc - 1.2 4.3 - v receiver output low voltage v ol i o = -8ma, v id = -200mv full - 0.25 0.4 v receiver output low current i ol v o = 1v, v id = -200mv full 20 28 - ma three-state (high impedance) receiver output current i ozr 0.4v v o 2.4v full -1 0.03 1 a receiver input resistance r in -7v v cm 12v full 96 160 - k receiver short-circuit current i osr 0v v o v cc full 7 65 85 ma supply current no-load supply current (note 3) i cc half duplex versions, de = v cc , re = x, di = 0v or v cc full - 650 800 a all versions, de = 0v, re = 0v, or full duplex versions, de = v cc , re = x. di = 0v or v cc full - 550 700 a shutdown supply current i shdn de = 0v, re = v cc , di = 0v or v cc full - 0.07 3 a esd performance rs-485 pins (a, y, b, z, a/y, b/z) iec61000-4-2, air-gap discharge method 1/2 duplex 25 - 16.5 - kv full duplex 25 - 10 - kv iec61000-4-2, contact discharge method 25 - 9 - kv human body model, from bus pins to gnd 25 - 16.5 - kv all pins human body model, per mil-std-883 method 3015 25 - 7 - kv machine model 25 - 400 - v driver switching characteristics (115kbps versions; isl3150e, isl3152e) driver differential output delay t plh, t phl r diff = 54 , c l = 100pf (figure 2) full 500 970 1300 ns driver differential output skew t skew r diff = 54 , c l = 100pf (figure 2) full - 12 50 ns driver differential rise or fall time t r , t f r diff = 54 , c l = 100pf (figure 2) full 700 1100 1600 ns maximum data rate f max c d = 820pf (figure 4) full 115 2000 - kbps driver enable to output high t zh r l = 500 , c l = 100pf, sw = gnd (figure 3), (note 5) full - 300 600 ns driver enable to output low t zl r l = 500 , c l = 100pf, sw = v cc (figure 3), (note 5) full - 130 500 ns driver disable from output low t lz r l = 500 , c l = 15pf, sw = v cc (figure 3) full - 50 65 ns driver disable from output high t hz r l = 500 , c l = 15pf, sw = gnd (figure 3) full - 35 60 ns time to shutdown t shdn (note 7) full 60 160 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 100pf, sw = gnd (figure 3), (notes 7, 8) full - - 250 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 100pf, sw = v cc (figure 3), (notes 7, 8) full - - 250 ns electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwise specified. typicals are at v cc = 5v, t a = +25c (note 2). (continued) parameter symbol test conditions temp (c) min (note 10) typ max (note 10) units isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
7 fn6363.1 january 18, 2008 driver switching characteristics (1mbps versions; isl3153e, isl3155e) driver differential output delay t plh, t phl r diff = 54 , c l = 100pf (figure 2) full 150 270 400 ns driver differential output skew t skew r diff = 54 , c l = 100pf (figure 2) full - 3 10 ns driver differential rise or fall time t r , t f r diff = 54 , c l = 100pf (figure 2) full 150 325 450 ns maximum data rate f max c d = 820pf (figure 4) full 1 8 - mbps driver enable to output high t zh r l = 500 , c l = 100pf, sw = gnd (figure 3), (note 5) full - 110 200 ns driver enable to output low t zl r l = 500 , c l = 100pf, sw = v cc (figure 3), (note 5) full - 60 200 ns driver disable from output low t lz r l = 500 , c l = 15pf, sw = v cc (figure 3) full - 50 65 ns driver disable from output high t hz r l = 500 , c l = 15pf, sw = gnd (figure 3) full - 35 60 ns time to shutdown t shdn (note 7) full 60 160 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 100pf, sw = gnd (figure 3), (notes 7, 8) full - - 250 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 100pf, sw = v cc (figure 3), (notes 7, 8) full - - 250 ns driver switching characteristics (20mbps versions; isl3156e, isl3158e) driver differential output delay t plh, t phl r diff = 54 , c l = 100pf (figure 2) full - 21 30 ns driver differential output skew t skew r diff = 54 , c l = 100pf (figure 2) full - 0.2 3 ns driver differential rise or fall time t r , t f r diff = 54 , c l = 100pf (figure 2) full - 12 16 ns maximum data rate f max c d = 470pf (figure 4) full 20 55 - mbps driver enable to output high t zh r l = 500 , c l = 100pf, sw = gnd (figure 3), (note 5) full - 30 45 ns driver enable to output low t zl r l = 500 , c l = 100pf, sw = v cc (figure 3), (note 5) full - 28 45 ns driver disable from output low t lz r l = 500 , c l = 15pf, sw = v cc (figure 3) full - 50 65 ns driver disable from output high t hz r l = 500 , c l = 15pf, sw = gnd (figure 3) full - 38 60 ns time to shutdown t shdn (note 7) full 60 160 600 ns driver enable from shutdown to output high t zh(shdn) r l = 500 , c l = 100pf, sw = gnd (figure 3), (notes 7, 8) full - - 200 ns driver enable from shutdown to output low t zl(shdn) r l = 500 , c l = 100pf, sw = v cc (figure 3), (notes 7, 8) full - - 200 ns receiver switching characteristics (115kbps and 1mbps versions; isl3150e through isl3155e) maximum data rate f max (figure 5) full 1 12 - mbps receiver input to output delay t plh , t phl (figure 5) full - 100 150 ns receiver skew | t plh - t phl |t skd (figure 5) full - 4 10 ns receiver enable to output low t zl r l = 1k , c l = 15pf, sw = v cc (figure 6), (note 6) full - 9 20 ns receiver enable to output high t zh r l = 1k , c l = 15pf, sw = gnd (figure 6), (note 6) full - 7 20 ns receiver disable from output low t lz r l = 1k , c l = 15pf, sw = v cc (figure 6) full - 8 15 ns receiver disable from output high t hz r l = 1k , c l = 15pf, sw = gnd (figure 6) full - 8 15 ns electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwise specified. typicals are at v cc = 5v, t a = +25c (note 2). (continued) parameter symbol test conditions temp (c) min (note 10) typ max (note 10) units isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
8 fn6363.1 january 18, 2008 time to shutdown t shdn (note 7) full 60 160 600 ns receiver enable from shutdown to output high t zh(shdn) r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 7, 9) full - - 200 ns receiver enable from shutdown to output low t zl(shdn) r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 7, 9) full - - 200 ns receiver switching characteristics (20mbps versions; isl3156e, isl3158e) maximum data rate f max (figure 5) full 20 30 - mbps receiver input to output delay t plh , t phl (figure 5) full - 33 45 ns receiver skew | t plh - t phl |t skd (figure 5) full - 2.5 5 ns receiver enable to output low t zl r l = 1k , c l = 15pf, sw = v cc (figure 6), (note 6) full - 8 15 ns receiver enable to output high t zh r l = 1k , c l = 15pf, sw = gnd (figure 6), (note 6) full - 7 15 ns receiver disable from output low t lz r l = 1k , c l = 15pf, sw = v cc (figure 6) full - 8 15 ns receiver disable from output high t hz r l = 1k , c l = 15pf, sw = gnd (figure 6) full - 8 15 ns time to shutdown t shdn (note 7) full 60 160 600 ns receiver enable from shutdown to output high t zh(shdn) r l = 1k , c l = 15pf, sw = gnd (figure 6), (notes 7, 9) full - - 200 ns receiver enable from shutdown to output low t zl(shdn) r l = 1k , c l = 15pf, sw = v cc (figure 6), (notes 7, 9) full - - 200 ns notes: 2. all currents into device pins are positive; all currents out of device pins are negative. a ll voltages are referenced to devi ce ground unless otherwise specified. 3. supply current specification is va lid for loaded drivers when de = 0v. 4. applies to peak current. see ?typical performanc e curves? beginning on page 13 for more information. 5. keep re = 0 to prevent the device from entering shdn. 6. the re signal high time must be short enough (typically <100ns) to prevent the device from entering shdn. 7. transceivers are put into shutdown by bringing re high and de low. if the inputs are in this state for less than 60ns, the parts are guaranteed not to enter shutdown. if the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. s ee ?low power shutdown mode? on page 12. 8. keep re = vcc, and set the de signal low time >600ns to ensure that the device enters shdn. 9. set the re signal high time >600ns to ens ure that the device enters shdn. 10. parts are 100% tested at +25c. over-temperature limits es tablished by characterization and are not production tested. 11. see figure 8 for more information, and for performance over-temperature. electrical specifications test conditions: v cc = 4.5v to 5.5v; unless otherwise specified. typicals are at v cc = 5v, t a = +25c (note 2). (continued) parameter symbol test conditions temp (c) min (note 10) typ max (note 10) units isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
9 fn6363.1 january 18, 2008 test circuits and waveforms figure 1a. v od and v oc figure 1b. v od with common mode load figure 1. dc driver test circuits figure 2a. test circuit figure 2b. measurement points figure 2. driver propagation delay and differential transition times figure 3a. test circuit figure 3b. measurement points figure 3. driver enable and disable times d de di v cc v od v oc r l /2 r l /2 z y d de di v cc v od 375 375 z y r l = 60 v cm -7v to +12v d de di v cc signal generator c l = 100pf r diff z y c l = 100pf out (z) 3v 0v 1.5v 1.5v v oh v ol out (y) t plh t phl diff out (y - z) t r +v od -v od 90% 90% t f 10% 10% di skew = |t plh - t phl | d de di z y v cc gnd sw parameter output re di sw c l (pf) t hz y/z x 1/0 gnd 15 t lz y/z x 0/1 v cc 15 t zh y/z 0 (note 5) 1/0 gnd 100 t zl y/z 0 (note 5) 0/1 v cc 100 t zh(shdn) y/z 1 (note 8) 1/0 gnd 100 t zl(shdn) y/z 1 (note 8) 0/1 v cc 100 signal generator 500 c l out (y, z) 3v 0v 1.5v 1.5v v oh 0v v oh - 0.5v t hz out (y, z) v cc v ol v ol + 0.5v t lz de output high output low t zl , t zl(shdn) t zh , t zh(shdn) note 7 2.3v 2.3v note 7 note 7 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
10 fn6363.1 january 18, 2008 figure 4a. test circuit figure 4b. measurement points figure 4. driver data rate figure 5a. test circuit figure 5b. measurement points figure 5. receiver propagation delay and data rate figure 6a. test circuit figure 6b. measurement points figure 6. receiver enable and disable times test circuits and waveforms (continued) d de di v cc signal generator z y c d v od + - 60 3v 0v diff out (y - z) +v od -v od di 0v signal generator r ro re a b 0v 15pf ro +1.5v -1.5v t plh 0v 0v v cc 0v 1.5v 1.5v t phl a 1k v cc gnd sw parameter de a sw t hz 0 +1.5v gnd t lz 0 -1.5v v cc t zh (note 6) 0 +1.5v gnd t zl (note 6) 0 -1.5v v cc t zh(shdn) (note 9) 0 +1.5v gnd t zl(shdn) (note 9) 0 -1.5v v cc signal generator r ro re a b gnd 15pf ro 3v 0v 1.5v 1.5v v oh 0v 1.5v v oh - 0.5v t hz ro v cc v ol 1.5v v ol + 0.5v t lz re output high output low t zl , t zl(shdn) t zh , t zh(shdn) note 7 note 7 note 7 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
11 fn6363.1 january 18, 2008 application information rs-485 and rs-422 are differential (balanced) data transmission standards used for long haul or noisy environments. rs-422 is a subset of rs-485, so rs-485 transceivers are also rs-422 compliant. rs-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. rs-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. to allow for multipoint operation, the rs-485 specification requires that drivers must handle bus contention without sustaining any damage. another important advantage of rs-485 is the extended common mode range (cmr), which specifies that the driver outputs and receiver inputs withstand signals that range from +12v to -7v. rs-422 and rs-485 are intended for runs as long as 4000?, so the wide cmr is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. receiver (rx) features these devices utilize a differential input receiver for maximum noise immunity and common mode rejection. input sensitivity is better than 200mv, as required by the rs-422 and rs-485 specifications. rx outputs feature high driv e levels (typically 28ma @ v ol = 1v to ease the design of optically coupled isolated interfaces). receiver input resistance of 96k surpasses the rs-422 specification of 4k , and is eight times the rs-485 ?unit load (ul)? requirement of 12k minimum. thus, these products are known as ?one-eighth ul? transceivers, and there can be up to 256 of these devices on a network while still complying with the rs-485 loading specification. rx inputs function with common mode voltages as great as 7v outside the power supplies (i.e., +12v and -7v), making them ideal for long networks where induced voltages are a realistic concern. all the receivers include a ?fu ll fail-safe? function that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shor ted together, or connected to a terminated bus with all the transmitters disabled. receivers easily meet the data rates supported by the corresponding driver, and all receiver outputs are three-statable via the active low re input. driver (tx) features the rs-485/rs-422 driver is a di fferential output device that delivers at least 2.4v across a 54 load (rs-485), and at least 2.8v across a 100 load (rs-422). the drivers feature low propagation delay skew to maximize bit width, and to minimize emi, and all drivers are three-statable via the active high de input. the 115kbps and 1mbps driver outputs are slew rate limited to minimize emi, and to minimi ze reflections in unterminated or improperly terminated networks. outputs of the isl3156eand isl3158e drivers are not limited, so faster output transition times allow data rates of at least 20mbps high v od improves noise immunity and flexibility the isl315xe driver design deliv ers larger differential output voltages (v od ) than the rs-485 stand ard requires, or than most rs-485 transmitters can deliver. the minimum 2.4v v od guarantees at least 900mv more noise immunity than networks built using standard 1.5v v od transmitters. another advantage of the large v od is the ability to drive more than two bus terminations, which allows for utilizing the isl315xe in ?star? and other multi-terminated, ?non-standard? network topol ogies. figure 8, details the transmitter?s v od vs i out characteristic, and includes load lines for six (20 ) and eight (15 ) 120 terminations. the figure shows that the driver typically delivers 1.65/1.5v into 6/8 terminations, even at the worst case temperature of +85 c.the rs-485 standard requires a minimum 1.5v v od into two terminations, but the isl315xe delivers rs-485 voltage levels with 3x to 4x the number of terminations. hot plug function when a piece of equipment powers up, there is a period of time where the processor or asic driving the rs-485 control lines (de, re ) is unable to ensure that the rs-485 tx and rx outputs are kept disabled. if the equipment is connected to the bus, a driver activating prematurely during power-up may crash the bus. to avoid this scenario, the isl315xe devices incorporate a ?hot plug? function. circuitry monitoring v cc ensures that, during power-up and power-down, the tx and rx outputs remain disabled, regardless of the state of de and re , if v cc is less than ~3.4v. this gives the processor/asic a chance to st abilize and drive the rs-485 control lines to the proper states. figure 7. hot plug performance (isl315xe) vs isl83088e without hot plug circuitry time (40s/div) v cc receiver output (v) driver y output (v) 2.5 5.0 2.5 5.0 v cc (v) r l = 1k ro 0 2.5 5.0 0 0 a / y r l = 1k 3.3v 3.5v isl315xe isl315xe re = gnd de, di = v cc isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
12 fn6363.1 january 18, 2008 esd protection all pins on these devices in clude class 3 (>7kv) human body model (hbm) esd protec tion structures, but the rs-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive esd events in excess of 16.5kv hbm and 16.5kv (1/2 duplex) iec61000-4-2. the rs -485 pins are particularly vulnerable to esd strikes because they typically connect to an exposed port on the exte rior of the finished product. simply touching the port pins , or connecting a cable, can cause an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, and without degrading the rs-485 common mode range of -7v to +12v. this built-in esd protection eliminates the ne ed for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are t hose that are exposed to the outside world (the rs-485 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. the iec61000 standard?s lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd protection built into this device?s rs-485 pins allows the design of equipment meeting leve l 4 criteria without the need for additional board level protection on the rs-485 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. the isl315xe 1/2 duplex rs-485 pins withstand 16.5kv air-gap discharges. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 9kv. the rs-485 pins of all the isl315xe versions survive 9kv contact discharges. data rate, cables , and terminations rs-485/rs-422 are intended for network lengths up to 4000?, but the maximu m system data rate decreases as the transmission length increases. devices operating at 20mbps are limited to lengths less than 100?, while the 115kbps versions can operate at full data rates with lengths of several 1000?. twisted pair is the cable of choice for rs-485/rs-422 networks. twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ics. proper termination is imperative, when using the 20mbps devices, to minimize reflecti ons. short networks using the 115kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. in point-to-point, or point-to-mu ltipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120 ) at the end farthest from the driver. in multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. multipoint (multi-driver) systems require that the main cable be terminated in its characteristic impedance at both ends. stubs connecting a transceiver to the main cable should be kept as short as possible. built-in driver overload protection as stated previously, the rs-4 85 specification requires that drivers survive worst case bus contentions undamaged. these devices meet this require ment via driver output short circuit current limits, and on-chip thermal shutdown circuitry. the driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the rs-485 specificat ion, even at the common mode voltage range extremes. in the event of a major short circuit condition, devices also include a thermal shutdown featur e that disables the drivers whenever the die temperature becomes excessive. this eliminates the power dissipation, allowing the die to cool. the drivers automatically re-enable after the die temperature drops about 15. if the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. receivers stay operational during thermal shutdown. low power shutdown mode these cmos transceivers all use a fraction of the power required by their bipolar counterpa rts, but they also include a shutdown feature that reduces the already low quiescent i cc to a 70na trickle. these devices enter shutdown whenever the receiver and driver are simultaneously disabled (re =v cc and de = gnd) for a period of at least 600ns. disabling both the driver and t he receiver for less than 60ns guarantees that the transcei ver will not enter shutdown. note that receiver and driver enable times increase when the transceiver enables from shutdown. refer to notes 5, 6, 7, 8 and 9, at the end of the ?ele ctrical specification? table on page 8, for more information. isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
13 fn6363.1 january 18, 2008 typical performance curves v cc = 5v, t a = +25c; unless otherwise specified. figure 8. driver output current vs differential output voltage figure 9. driver differential output voltage vs temperature figure 10. driver output current vs short circuit voltage figure 11. supply current vs temperature figure 12. driver differential propagation delay vs temperature (isl3150e, isl3152e) figure 13. driver differential skew vs temperature (isl3150e, isl3152e) differential output voltage (v) driver output current (ma) 012345 0 10 40 60 80 100 120 140 30 50 70 90 110 130 20 +25c +85c r d = 15 r d = 20 r d = 54 r d = 100 -40 0 50 85 temperature (c) differential output voltage (v) -25 25 75 2.9 3.1 3.2 3.3 3.4 3.5 3.6 3.7 r diff = 54 r diff = 100 3.0 output voltage (v) -7 -6 -4 -2 0 2 4 6 8 10 12 output current (ma) -50 0 50 100 150 200 -100 -200 -150 y or z = high y or z = low -40 0 50 85 temperature (c) i cc (a) -25 25 75 500 540 580 600 620 640 660 520 560 de = v cc , re = x de = gnd, re = gnd -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) 960 980 985 990 995 1000 1005 1010 t plh t phl 965 970 975 12 9 8 7 6 5 4 -40 0 50 85 temperature (c) skew (ns) -25 25 75 |cross pt. of y and z - cross pt. of y and z | 11 10 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
14 fn6363.1 january 18, 2008 figure 14. driver differential propagation delay vs temperature (isl3153e, isl3155e) figure 15. driver differential skew vs temperature (isl3153e, isl3155e) figure 16. driver differential propagation delay vs temperature (isl3156e, isl3158e) figure 17. driver differential skew vs temperature (isl3156e, isl3158e) figure 18. driver and receiver waveforms, (isl3150e, isl3152e) figure 19. driver and receiver waveforms, (isl3153e, isl3155e) typical performance curves v cc = 5v, t a = +25c; unless otherwise specified. (continued) -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) 270 280 282 284 286 288 290 272 274 276 278 -40 0 50 85 temperature (c) skew (ns) -25 25 75 3.5 3.0 2.5 2.0 1.5 1.0 |cross pt. of y and z - cross pt. of y and z | -40 0 50 85 temperature (c) -25 25 75 propagation delay (ns) 17 20 21 22 23 24 18 19 -40 0 50 85 temperature (c) skew (ns) -25 25 75 0.28 0.18 0.16 0.14 0.12 0.10 |cross pt. of y and z - cross pt. of y and z | 0.26 0.24 0.22 0.20 1 4 5 2 3 time (1 s / div) receiver output (v) r diff = 54 , c l = 100pf 0 5 driver output (v) 0 5 driver input (v) di ro a / y b / z 1 4 5 2 3 time (400ns / div) receiver output (v) r diff = 54 , c l = 100pf 0 5 driver output (v) 0 5 driver input (v) di ro b / z a / y isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
15 fn6363.1 january 18, 2008 figure 20. driver and receiver waveforms, (isl3156e, isl3158e) figure 21. receiver output current vs receiver output voltage die characteristics substrate potential (powered up): gnd transistor count: 530 process: si gate bicmos typical performance curves v cc = 5v, t a = +25c; unless otherwise specified. (continued) 1 4 5 2 3 time (20ns / div) receiver output (v) r diff = 54 , c l = 100pf 0 5 driver output (v) 0 5 driver input (v) di ro b / z a / y receiver output voltage (v) receiver output current (ma) 012345 0 10 20 30 50 60 40 v oh , +25c v oh , +85c v ol , +25c v ol , +85c isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
16 fn6363.1 january 18, 2008 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e mini small outline pl astic packages (msop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-187ba. 2. dimensioning and tolerancing per ansi y14.5m - 1994. 3. dimension ?d? does not include mold flash, protrusions or gate burrs and are measured at datum plane. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions and are measured at datum plane. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. formed leads shall be planar wi th respect to one another within 0.10mm (0.004) at seating plane. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. datums and to be determined at datum plane . 11. controlling dimension: millimeter. converted inch dimen- sions are for reference only. l 0.25 (0.010) l1 r1 r 4x 4x gauge plane seating plane e e1 n 12 top view index area -c- -b- 0.20 (0.008) a b c seating plane 0.20 (0.008) c 0.10 (0.004) c -a- -h- side view b e d a a1 a2 -b- end view 0.20 (0.008) c d e 1 c l c a - h - -a - - b - - h - m8.118 (jedec mo-187aa) 8 lead mini small outline plastic package symbol inches millimeters notes min max min max a 0.037 0.043 0.94 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.030 0.037 0.75 0.95 - b 0.010 0.014 0.25 0.36 9 c 0.004 0.008 0.09 0.20 - d 0.116 0.120 2.95 3.05 3 e1 0.116 0.120 2.95 3.05 4 e 0.026 bsc 0.65 bsc - e 0.187 0.199 4.75 5.05 - l 0.016 0.028 0.40 0.70 6 l1 0.037 ref 0.95 ref - n8 87 r 0.003 - 0.07 - - r1 0.003 - 0.07 - - 0 5 o 15 o 5 o 15 o - 0 o 6 o 0 o 6 o - rev. 2 01/03
17 fn6363.1 january 18, 2008 mini small outline pl astic packages (msop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-187ba. 2. dimensioning and tolerancing per ansi y14.5m - 1994. 3. dimension ?d? does not include mold flash, protrusions or gate burrs and are measured at datum plane. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions and are measured at datum plane. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. formed leads shall be planar wi th respect to one another within 0.10mm (.004) at seating plane. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. datums and to be determined at datum plane . 11. controlling dimension: millimeter. converted inch dimen- sions are for reference only l 0.25 (0.010) l1 r1 r 4x 4x gauge plane seating plane e e1 n 12 top view index area -c- -b- 0.20 (0.008) a b c seating plane 0.20 (0.008) c 0.10 (0.004) c -a- -h- side view b e d a a1 a2 -b- end view 0.20 (0.008) c d e 1 c l c a - h - -a - - b - - h - m10.118 (jedec mo-187ba) 10 lead mini small outline plastic package symbol inches millimeters notes min max min max a 0.037 0.043 0.94 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.030 0.037 0.75 0.95 - b 0.007 0.011 0.18 0.27 9 c 0.004 0.008 0.09 0.20 - d 0.116 0.120 2.95 3.05 3 e1 0.116 0.120 2.95 3.05 4 e 0.020 bsc 0.50 bsc - e 0.187 0.199 4.75 5.05 - l 0.016 0.028 0.40 0.70 6 l1 0.037 ref 0.95 ref - n10 107 r 0.003 - 0.07 - - r1 0.003 - 0.07 - - 5 o 15 o 5 o 15 o - 0 o 6 o 0 o 6 o - rev. 0 12/02 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e
18 fn6363.1 january 18, 2008 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include inte rlead flash or protrusions. interlead flash and protrusions shall not ex ceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m14.15 (jedec ms-012-ab issue c) 14 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.3367 0.3444 8.55 8.75 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n14 147 0 o 8 o 0 o 8 o - rev. 0 12/93
19 fn6363.1 january 18, 2008 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e dual-in-line plastic packages (pdip) c l e e a c e b e c -b- e1 index 12 3 n/2 n area seating base plane plane -c- d1 b1 b e d d1 a a2 l a 1 -a- 0.010 (0.25) c a m bs notes: 1. controlling dimensions: inch. in case of conflict between english and metric dimensions, the inch dimensions control. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. symbols are defined in the ?mo se ries symbol list? in section 2.2 of publication no. 95. 4. dimensions a, a1 and l are m easured with the package seated in jedec seating plane gauge gs - 3. 5. d, d1, and e1 dimensions do not include mold flash or protru- sions. mold flash or protrusi ons shall not exceed 0.010 inch (0.25mm). 6. e and are measured with the leads constrained to be per- pendicular to datum . 7. e b and e c are measured at the lead tips with the leads uncon- strained. e c must be zero or greater. 8. b1 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. n is the maximum number of terminal positions. 10. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- e8.3 (jedec ms-001-ba issue d) 8 lead dual-in-line plastic package symbol inches millimeters notes min max min max a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.15 1.77 8, 10 c 0.008 0.014 0.204 0.355 - d 0.355 0.400 9.01 10.16 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n8 89 rev. 0 12/93
20 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6363.1 january 18, 2008 isl3150e, isl3152e, isl3153e, isl3155e, isl3156e, isl3158e small outline plast ic packages (soic) index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 c h 0.25(0.010) b m m notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. m8.15 (jedec ms-012-aa issue c) 8 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.1890 0.1968 4.80 5.00 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n8 87 0 8 0 8 - rev. 1 6/05

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